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Heat Sink Compound
Aids in the efficient transfer of heat away from electronics and electrical components, including CPUs, heat generating elements and mechanical heat sinks.
- Proprietary Compound – Blended with thermally conductive, fine metal oxide powders. Will not harden, dry out or melt.
- Specialized Application – Extends life of heat sensitive electrical parts through superior heat management and transfer
- Low Bleed – Carefully engineered rheological properties, allow the non-curing silicone material to tenaciously adhere to surfaces without excessive migration or separation of its fluid components over time
- High Dielectric Strength – Insulates and prevents arcing or tracking between electrical components operating at high voltages
- Safety Data Sheets
- Technical Data Sheets
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Product Catalogs
Main Catalog
4-Page Catalog
Product List
Specialty Products
Heat Sink Compound
Specialty Products
3 OZ
Tube
SKU# 98003
Specialty Products
5 LB
Pail
SKU# 98050
Applications
Heat Transfer and Thermal Management
Transfer of heat from an electrical device to the heat sink or chassis. Fills surface imperfections on CPU to prevent air pockets and enhance heat transfer.
Electronic Components
Semiconductors, power diodes, transistors.
Automotive Electrical Systems
Alternators, regulators and rectifiers.
